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Glass Substrate Deposition System “Low Temperature Deposition” “Flexible Substrate Support”

4.5 generation glass substrate deposition system for rigid/flexible devices such as FPD.

4.5 generation glass substrate deposition system for rigid/flexible devices such as FPD. 【Features】 　・Low temperature (150-300 degrees C) deposition 　・Deposition of 100 nm SiO2 film on 4.5 generation glass substrates at 250 degrees C with a throughput of 25 wafers/hour or more 　・Simple maintenance 　・Low CoO (low running cost) 　・High-quality SiO2 deposition formation: low stress, no plasma damage, small particles 　・Low installation and maintenance cost: small footprint, no need for vacuum or plasma 　 　　treatment 【Applications】 　・Insulating deposition for FPD (NSG) 　・Oxide semiconductor TFT passivation deposition (NSG) *For more details, please contact us or download the catalog to view.